PIR THERMAL INSULATION
LOGICPIR is a board made of rigid PIR (Polyisocyanurate) for use in flat roofing systems. Being very rigid and perfectly flat, LOGICPIR is an ideal substrate for roofing materials, especially for synthetic membranes. LOGICPIR has high compressive strength and a very low thermal conductivity value of 0.022 W/m*K. More than 95% of PIR consists of closed cells. PIR board does not absorb water. It maintains stable parameters for a long period of time.